Supplementary process – Syscoset

Supplementary process

To accomplish the scale of full-range electronic production, we can further offer the following processes:

Sealing
Sealing of electronic modules with two component PU.
Galvanization
Galvanization of metal parts, with different surface finishing.

Metal punching
Metal punching and design of the relevant tooling.
Plastic moulding
Plastic moulding and design of moulds.