- SMD lines – total capacity of 500 million placings per year. All widespread components from size 0201 to 50 x 50 mm, can be placed in all common pitch grids. All production lines include dispensing, screen printing, and inspection units. ( Reflow under N2 atmosphere).
- Wire confection is based on two cut-and-strip machines, followed by several different tools for wire crimping and confection.
- Component preparation – cut, kink, bend, special shapes, stand-off, for different lead thickness.
- Double solder wave Seho, N2 equipped, width 400mm. Customer designed, in-house made solder frames, fixings and pushers for component positioning.
- Insertion tools – pneumatically driven, for different types of fast-on connectors.
- Varnishing cabin for conformal and selective coating.
- In-circuit test systems ICT -free programmable.
- 3 Axis full automatic varnishing machine.
- EMC laboratory for inhouse development
- Cross section laboratory
- Press fit possibilities
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